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Summary: 1. Lead the research and development of next-generation substrate technologies for advanced semiconductor packaging 2. The candidate will be responsible for driving innovation in substrate design, materials, and processes, as well as establishing and controlling the engineering baseline for new substrate manufacturing facilities during the engineering stage and ramp-up phases 3. With deep technical expertise, cross-functional leadership, and a proven track record in substrate technology development and manufacturing stabilization. RESPONSIBILITIES: 1. Lead the research, development, and qualification of new substrate technologies (eg. SIP, advantage laminates pp, high power substrate, high copper thickness) to meet performance, reliability, and cost targets. 2. Collaborate with material suppliers, equipment vendors, and internal team to evaluate and implement innovative solutions 3. Define and establish the engineering baseline (process, equipment, and engineering specs) for new substrate manufacturing facilities prior to mass production 4. Oversee process characterization, capability analysis, and optimization during the early stages of factory ramp-up 5. Drive root-cause analysis and resolution of technical issues related to substrate fabrication, thermal management, and reliability 6. Stay updated with industry trends and emerging substrate technologies to guide strategic development plans. REQUIREMENTS: 1. Deep knowledge of substrate materials (eg. SIP, advantage laminates pp, high power substrate, high copper thickness) design rules, fabrication processes (laser drilling, plating, lamination), and reliability testing. 2. Proven experience in new factory startup, process baseline establishment, and yield ramp-up. 3. Strong analytical skills with expertise in DOE, SPC, and failure analysis techniques. 4. Bachelor’s degree with 10 years related experience.