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The Day-to-Day
- Design, develop and scale to volume production of high voltage/high power packages and modules for the industrial, automotive, renewable and telecom markets.
- The candidate can understand system requirements and build these into the definition of the package to meet electrical, thermal, and mechanical specifications.
- The candidate can identify prototype/subcon partners, assess manufacturing capabilities and drive completion of 1st article builds.
- The candidate can be capable of developing new process flows/technologies necessary for building prototypes.
- The candidate can outline the package reliability plans, complete testing, summarize failure modes and identify fixes via or design and material selection.
- The candidate must have a broad knowledge of the package materials (molding compound, die attach, substrate etc) for high voltage/high power packages and modules.
Minimum Qualifications:
- BS or MS degree in Mechanical, Material Science, Electrical Engineering or related engineering degree
- 3 year of experience in design of high voltage/high power packages and modules across MOSFET, IGBT, SiC, GaN technologies.
- Proficiency in CAD software, SolidWorks / Auto CAD preferred.
- Knowledge in various packaging technology, process flow, material, qualification and manufacturing implementation.
- Knowledge in high voltage/high power package reliability requirements, failure analysis techniques, assembly process issues, etc.
- Therlectrical, stress simulation skills are a plus.
- Strong communication, presentation, and interpersonal skills.
- Problem-solving mindset.